- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/02 - Housing; Enclosing; Embedding; Filling the housing or enclosure
Patent holdings for IPC class H01C 1/02
Total number of patents in this class: 111
10-year publication summary
5
|
9
|
10
|
11
|
15
|
10
|
11
|
8
|
9
|
3
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
KOA Corporation | 381 |
11 |
Vishay Dale Electronics, LLC | 106 |
6 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
5 |
Hamilton Sundstrand Corporation | 4525 |
5 |
Hubbell Incorporated | 3052 |
4 |
Siemens Energy Global GmbH & Co. KG | 2775 |
4 |
Rohm Co., Ltd. | 5843 |
3 |
NR Electric Co., Ltd. | 302 |
3 |
NR Engineering Co., Ltd | 266 |
3 |
NR Electric Power Electronics Co., Ltd. | 39 |
3 |
TDK Electronics AG | 863 |
3 |
Ford Global Technologies, LLC | 19702 |
2 |
Eaton Intelligent Power Limited | 6113 |
2 |
Niterra Co., Ltd. | 1122 |
2 |
Hitachi Energy Ltd. | 1921 |
2 |
Siemens AG | 24990 |
1 |
Micron Technology, Inc. | 24960 |
1 |
Texas Instruments Incorporated | 19376 |
1 |
Electronics and Telecommunications Research Institute | 8830 |
1 |
Murata Manufacturing Co., Ltd. | 22355 |
1 |
Other owners | 48 |